Lead-Free Solder Process Development
March 2011, Wiley-IEEE Press
A practicing engineer will find the book of use as it goes into these topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Chapters on Soldering Fluxes, Component Finishes, Alloys, EDXRF and certain areas on reliability have not been covered in sufficient detail in previous books, so the proposed book will be a timely reference for engineers in the field. The lead-free solder process window has been found to be smaller than for tin-lead, so a specific chapter is dedicated to Six Sigma process methodologies to help engineers approach lead-free soldering processes with better evaluation and process methodologies.