Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems
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Foreword by Dr. Craig Hillman.
Series Editor’s Preface.
About the Authors.
1.1. The Three Goals of the Book.
1.2. Historical Perspective
1.4. State of the Art and Future Trends.
1.5. General Plan of the Book.
2 Failure Analysis - Why?
2.1. Eight Possible Applications.
2.2. Forensic Engineering.
2.3. Reliability Modeling.
2.4. Reverse Engineering.
2.5. Controlling Critical Input Variables.
2.6. Design for Reliability.
2.7. Process Improvement.
2.8. Saving Money by Early Control.
2.9. A Synergetic Approach.
3 Failure Analysis - When?
3.1. During Development Cycle.
3.2. Preparing the Fabrication.
3.3. FA during Fabrication.
3.4. FA after Fabrication.
3.5. FA during Operation or Storage.
4 Failure Analysis - How?
4.1. Procedures for failure analysis.
4.2. Techniques for decapsulating the device and for sample preparation.
4.3. Techniques for failure analysis.
5. Failure Analysis - What?
5.1 Failure Modes and Mechanisms at Various Process Steps.
5.2 Failure Modes and Mechanisms of Passive Electronic Parts.
5.3 Failure Modes and Mechanisms of Silicon Bipolar Technology.
5.4 Failure Modes and Mechanisms of MOS Technology.
5.5 Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies.
5.6 Failure Modes and Mechanisms of Non-Silicon Technologies.
5.7 Failure Modes and Mechanisms of Hybrid Technology.
5.8 Failure Modes and Mechanisms of Microsystem Technologies.
6 Case Studies.
6.1 Case Study No. 1: Capacitors.
6.2 Case Study No. 2: Bipolar Power Devices.
6.3 Case Study No. 3: CMOS Devices.
6.4 Case Study No. 4: MOS Field Effect Transistors.
6.5 Case Study No. 5: Thin Film Transistors.
6.6 Case Study No. 6: High Electron Mobility Transistors.
6.7 Case Study No. 7: MEMS Resonators.
6.8 Case Study No. 8: MEMS Micro-Cantilevers.
6.9 Case Study No. 9: MEMS Switches.
6.10 Case Study No. 10: Magnetic MEMS Switches.
6.11 Case Study No. 11: Chip-Scale Packages.
6.12 Case Study No. 12: Solder Joints.
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