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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Sheng Liu, Yong Liu
ISBN: 978-0-470-82780-2
Hardcover
576 pages
May 2011
US $145.00 Add to Cart

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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing (0470827807) cover image
Other Available Formats: E-book

Modeling and Simulation for Packaging AssemblyVisit the companion website to access the Appendix and colour versions of selected figures from the book.