Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:

• Phase diagrams and alloy development
• Effect of minor alloying additions
• Composite approaches including nanoscale reinforcements
• Mechanical issues affecting reliability
• Reliability under impact loading
• Thermomechanical fatigue
• Chemical issues affecting reliability
• Whisker growth
• Electromigration
• Thermomigration

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.