 Chemical Mechanical Planarization of Microelectronic Materials
ISBN: 978-0-471-13827-3
Hardcover
337 pages
February 1997
US $155.00
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Chemical Mechanical Planarization-An Introduction.
Historical Motivations for CMP.
CMP Variables and Manipulations.
Mechanical and Electrochemical Concepts for CMP.
Oxide CMP Process-Mechanisms and Models.
Tungsten and CMP Processes.
Copper CMP.
CMP of Other Materials and New CMP Applications.
Post-CMP Cleanup.
Appendix.
Index.
Historical Motivations for CMP.
CMP Variables and Manipulations.
Mechanical and Electrochemical Concepts for CMP.
Oxide CMP Process-Mechanisms and Models.
Tungsten and CMP Processes.
Copper CMP.
CMP of Other Materials and New CMP Applications.
Post-CMP Cleanup.
Appendix.
Index.
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