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Chemical Mechanical Planarization of Microelectronic Materials
ISBN: 978-0-471-13827-3
Hardcover
337 pages
February 1997
US $155.00 Add to Cart

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  • Description
  • Table of Contents
  • Author Information
Chemical Mechanical Planarization-An Introduction.

Historical Motivations for CMP.

CMP Variables and Manipulations.

Mechanical and Electrochemical Concepts for CMP.

Oxide CMP Process-Mechanisms and Models.

Tungsten and CMP Processes.

Copper CMP.

CMP of Other Materials and New CMP Applications.

Post-CMP Cleanup.

Appendix.

Index.