Signal Integrity Effects in Custom IC and ASIC Designs
December 2001, Wiley-IEEE Press
—Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.
- Covers signal integrity effects in high performance Radio Frequency (RF) IC
- Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future
A Wiley-IEEE Press publication
From the Early Days of CMOS to Today.
Signal Integrity: A Problem for Design and CAD Engineers.
Signal Integrity Effects in Systme-on-Chip Designs - A Designer's Perspective.
Part 1: Interconnect Crosstalk.
Harmony: Static Noise Analysis of Deep Submicron Digital Integrated Circuits.
FastCap: A Multipole Accelerated 3-D Capacitance Extraction Program.
Efficient Coupled Noise Estimation for On-Chip Interconnects.
Switching Window Computation for Static Timing Analysis in Presence of Crosstalk Noise.
Digital Sensitivity: Predicting Signal Interaction using Functional Analysis.
Crosstalk Reduction for VLSI.
Noise-aware Repeater Insertion and Wire Sizing For On-Chip Interconnect Hierarchical Moment-Matching.
Post Global Routing Crosstalk Synthesis.
Minimum Crosstalk Channel Routing.
Reducing Cross-Coupling among Interconnect Wires in Deep-Submicron Datapath Design.
A Postprocessing Algorithm for Crosstalk-driven Wire Perturbation.
Noise in Digital Dynamic CMOS Circuits.
Design of Dynamic Circuits with Enhanced Noise Tolerance.
Coupling-Driven Signal Encoding Scheme for Low-Power Interface Design.
High Frequency Simulation and Characterization of Advanced Copper Interconnects.
Static Noise Analysis for Digital Integrated Circuits in Partially-Depleted Silicon-On-Insulator Technology.
Synthesis of CMOS Domino Circuits for Charge Sharing Alleviation.
Part 2: Inductance Effects.
On-Chip Wiring Design Challenges for Gigahertz Operation.
IC Analyses Including Extracted Inductance Models.
FASTHENRY: A Multipole-Accelerated 3-D Inductance Extraction Program.
Full-Chip, Three-Dimensional, Shapes-Based RLC Extraction.
On-Chip Inductance Modeling and Analysis.
How to Efficiently Capture On-Chip Inductance Effects: Introducing a New Circuit Element K.
Figures of Merit to Characterize the Importance of On-Chip Inductance.
Layout-Techniques for Minimizing On-Chip Interconnect Self Inductance.
A Twisted-Bundle Layout Structure for Minimizing Inductive Coupling Noise.
Part 3: Power Grid and Distribution Noise.
Full-Chip Verification of UDSM Designs.
Power Supply Noise in Future IC's: A Crystal Ball Reading.
A Floorplan-based Planning Methodology for Power and Clock Distribution in ASICs.
Power Supply Noise Analysis Methodology for Deep-Submicron VLSI Chip Design.
Analysis of Performance Impact Caused by Power Supply Noise in Deep Submicron Devices.
Full-Chip Signal Interconnect Analysis for Electromigration Reliability.
Power Dissipation Analysis and Optimization of Deep Submicron CMOS Digital Circuits.
Simulation and Optimization of the Power Distribution Network in VLSI Circuits.
Design Strategies and Decoupling Techniques for Reducing the Effects of Electrical Interference in Mixed-Mode IC's.
Design and Analysis of Power Distribution Networks in Power PC Microprocessors.
Modeling the Power and Ground Effects of BGA Packages.
Effects of Power/Ground Via Distribution on the Power/Ground Performance of C4/BGA Packages.
Power Distribution Fidelity of Wirebond Compared to Flip Chip Devices in Grid Array Packages.
Forming Damped LRC Parasitic Circuits in Simultaneously Switched CMOS Output Buffers.
Part 4: Substrate Noise.
Experimental Results and Modeling Techniques for Substrate Noise in Mixed-Signal Integrated Circuits.
Principles of Substrate Crosstalk Generation in CMOS Circuits.
Experimental Comparison of Substrate Noise Coupling Using Different Wafer Types.
Modeling and Analysis of Substrate Coupling in Integrated Circuits.
Fast Methods for Extraction and Sparsification of Substrate Coupling.
SUBWAVE: A Methodology for Modeling Digital Substrate Noise Injection in Mixed-Signal ICs.
Substrate Modeling and Lumped Substrate Resistance Extraction for CMOS ESD/Latchup Circuit Simulation.
Analysis of Ground-Bounce Induced Substrate Noise Coupling in a Low Resistive Bulk Epitaxial Process: Design Strategies to Minimize Noise Effects on a Mixed-Signal Chip.
A Methodology for Measurement and Characterization of Substrate Noise in High Frequency Circuits.
Measurement of Digital Noise in Mixed-Signal Integrated Circuits.
Effects of Substrate Resistances on LNA Performance and a Bondpad Structure for Reducing the Effects in a Silicon Bipolar Technology.
A Study of Oscillator Jitter Due to Supply and Substrate Noise.
CMOS Technology Characterization for Analog and RF Design.
Noise Reduction Is Crucial to Mixed-Signal ASIC Design Success (Parts I & II).
About the Editor.
(Alina Deutsch, Research Staff Member, T.J. Watson Research Center, International Business Machines)
"Electrical integrity (or environment noise) is becoming the principal obstacle in system-on-a-chip design. Digital circuits create a very noisy environment in which other digital and analog circuits must function. This environmental noise comes about because of coupling through the interconnect, power supply, and substrate. This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip."
(Kenneth L. Shepard, Professor, Columbia University)
"The explosion of wireless communications that offer greater mobility and broadband communications that provide super fast access to the Internet have placed new demands on IC designers. The key to developing successful Systems on Chip designs that offer Analog and Mixed Signal capabilities is the approach used to extract and analyze the affects of parasitics on signal integrity. This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity."
(Jake Buurma Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.)
"As technology scales to .1 micron and below, second order effects due to physical phenomena that were not much visible before start playing a more and more significant role. So much so that well-established methodologies and tools are not providing the necessary level of confidence to the designer that her/his integrated circuit will perform as planned. The need for more accurate extraction and analysis is obvious when we observe horror stories about very hard to detect intermittent faults created by interactions among signals on different wires. There are two complementary approaches to the problem that come to mind as always when we go over the limit of previous methods - increase the accuracy of the analysis tools, and/or solve the problems by imposing constraints on the degrees of freedom left to the designer. This collection of papers covers both in details. It is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection."
(Alberto Sangiovanni-Vincentelli, Professor, University of California Berkeley)