 Copper—Fundamental Mechanisms for Microelectronic Applications
ISBN: 978-0-471-25256-6
Hardcover
337 pages
April 2000
US $141.95
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Overview of IC Interconnects.
Behavior of Copper Impurity Atoms.
Copper-Related Defects in Silicon.
Chemistry and Electrochemistry.
Copper in Inorganic Dielectrics.
Copper in Organic Dielectrics (Polymers).
Diffusion and Compound Formation.
Layered Structures Containing Copper.
Copper for IC Metallization.
Future Directions in Copper Technology.
Appendix.
Index.
Behavior of Copper Impurity Atoms.
Copper-Related Defects in Silicon.
Chemistry and Electrochemistry.
Copper in Inorganic Dielectrics.
Copper in Organic Dielectrics (Polymers).
Diffusion and Compound Formation.
Layered Structures Containing Copper.
Copper for IC Metallization.
Future Directions in Copper Technology.
Appendix.
Index.
