  ULSI Semiconductor Technology Atlas
ISBN: 978-0-471-45772-5
Hardcover
666 pages
October 2003
US $204.00
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PREFACE.
PART I.
1. Microelectronics and Microscopy.
2. ULSI Process Technology.
3. Applications of TEM for Construction Analysis.
4. TEM Sample Preparation Techniques.
PART II.
5. Ion Implantation and Substrate Defects.
6. Dielectrics and Isolation.
7. Silicides, Polycide, and Salicide.
8. Metallization and Interconnects.
PART III.
9. ULSI Devices I: DRAM Cell with Planar Capacitor.
10. ULSI Devices II: DRAM Cell with Stacked Capacitor.
11. ULSI Devices III: DRAM Cell with Trench Capacitor.
12. ULSI Devices IV: SRAM.
PART IV.
13. TEM in Failure Analysis.
14. Novel Devices and Materials.
15. TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies.
16. High-Resolution TEM in Microelectronics.
INDEX.
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