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Textbook
Advanced Electronic Packaging, 2nd EditionISBN: 978-0-471-46609-3
Hardcover
840 pages
February 2006, ©2006, Wiley-IEEE Press
This price is valid for United States. Change location to view local pricing and availability. ![]() This is a Print-on-Demand title. It will be printed specifically to fill your order. Please allow an additional 5-6 days delivery time. The book is not returnable.
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Richard K. Ulrich is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society.
WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

