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Textbook
Advanced Electronic Packaging, 2nd EditionISBN: 978-0-471-46609-3
Hardcover
840 pages
February 2006, ©2006, Wiley-IEEE Press
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Topics covered include packaging materials and applications, analytical techniques for materials, fabrication technologies in packaging, substrate technologies, basic electrical, mechanical, and thermal considerations, package design, modeling and simulation, integrated passive devices, MEMS packaging, RF and microwave packaging, reliability considerations, cost evaluation and analysis, and 3-dimensional packaging.
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