Routing in the Third Dimension : From VLSI Chips to MCMsISBN: 978-0-7803-1089-6
Hardcover
376 pages
March 1995, Wiley-IEEE Press
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This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
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Routing in the Third Dimension : From VLSI Chips to MCMs (US $155.50)
-and- VHDL for Logic Synthesis, 3rd Edition (US $85.00)
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