Wiley
Wiley.com
Print this page Share

Reliability of MEMS: Testing of Materials and Devices, Volume 6

Oliver Brand (Series Editor), Gary K. Fedder (Series Editor), Christofer Hierold (Series Editor), Jan G. Korvink (Series Editor), Osamu Tabata (Editor), Toshiyuki Tsuchiya (Editor)
ISBN: 978-3-527-31494-2
Hardcover
324 pages
February 2008
US $280.00 Add to Cart

This price is valid for United States. Change location to view local pricing and availability.

Reliability of MEMS: Testing of Materials and Devices, Volume 6 (3527314946) cover image

Introduction -
Reliability Issues in MEMS
Part I: Mechanical Reliability of MEMS Materials
Mechanical Properties of MEMS Materials
Micro/Nano-Indenters
Bulge Methods
Bending Test using Probe Tools
Uni-axial Tensile Test with Specialized Chucking Methods
On-chip Microstructures
Part II: Reliability of MEMS Devices
Pressure Sensors
Inertial Sensors
RF MEMS
Optical MEMS

Buy Both and Save 25%!

+

Reliability of MEMS: Testing of Materials and Devices, Volume 6 (US $280.00)

-and- Scaling Issues and Design of MEMS (US $140.00)

Total List Price: US $420.00
Discounted Price: US $315.00 (Save: US $105.00)

Add BOTH to Cart
Cannot be combined with any other offers. Learn more.