Handbook of Wafer BondingISBN: 978-3-527-32646-4
Hardcover
425 pages
February 2012
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Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
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Handbook of Wafer Bonding (US $210.00)
-and- Inorganic Nanostructures: Properties and Characterization (US $140.00)
Total List Price: US $350.00
Discounted Price: US $262.50 (Save: US $87.50)
