Chapter 2: Materials for microelectronic packaging.

Chapter 3: Processing technologies.

Chapter 4: Organic printed circuit board materials and processes.

Chapter 5: Ceramic substrates.

Chapter 6: Electrical considerations, modeling, and simulation.

Chapter 7: Thermal considerations.

Chapter 8: Mechanical design considerations.

Chapter 9: Discrete and embedded passive devices.

Chapter 10: Electronic package assembly.

Chapter 11: Design considerations.

Chapter 12: Radio frequency and microwave packaging.

Chapter 13: Power electronics packaging.

Chapter 14: Multichip and three-dimensional packaging.

Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.

Chapter 16: Reliability considerations.

Chapter 17: Cost evaluation and analysis.

Chapter 18: Analytical techniques for materials characterization.

WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

• The book addesses all aspects of electronic packaging, but will emphasize advanced packaging technologies.
• Topics covered include packaging materials and applications, analytical techniques for materials, fabrication technologies in packaging, substrate technologies, basic electrical, mechanical, and thermal considerations, package design, modeling and simulation, integrated passive devices, MEMS packaging, RF and microwave packaging, reliability considerations, cost evaluation and analysis, and 3-dimensional packaging.

"...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006)

"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." (Chip Scale Review, July 2006)

"…useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." (CircuiTree, May 1, 2006)