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Handbook of 3D Integration, Volumes 1 and 2: Technology and Applications of 3D Integrated Circuits

Handbook of 3D Integration, Volumes 1 and 2: Technology and Applications of 3D Integrated Circuits

Philip Garrou (Editor), Christopher Bower (Editor), Peter Ramm (Editor)

ISBN: 978-3-527-33265-6

Oct 2012

799 pages

Select type: Paperback

In Stock



The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics
into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook
presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging
technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration
to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in
detail. This is followed by fields of application and a look at the future of 3D integration.

The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
1 Introduction to 3D Integration
2 Drivers for 3D Integration
3 Overview of 3D Process Technology

Part I -
Through Silicon Via Fabrication
4 Deep Reactive Ion Etching
5 Laser Ablation
6 Insulation -
7 Insulation -
Organic Dielectrics
8 Copper Plating
9 Metallization by chemical vapor deposition of W and Cu

Part II -
Wafer Thinning and Bonding Technology
10 Fabrication, Processing and Singulation of Thin Wafers
11 Overview of Bonding Technologies for 3D Integration
12 Chip-to-Wafer and Wafer-to-Wafer Integration Schemes
13 Polymer Adhesive Bonding Technology
14 Bonding with Intermetallic Compounds

Part III -
Integration Processes
15 Commercial Activity
16 Fraunhofer IZM
17 Interconnect Process at the University of Arkansas
18 Vertical Interconnection by ASET at Toshiba
19 3D Integration at CEA-LETI
20 Lincoln Laboratory's Integration Technology
21 3D Integration Technologies at IMEC
22 Fabrication Using Copper Thermo-Compression Bonding at MIT
23 Rensselaer 3D Integration Processes
24 3D Integration at Tezzaron Semiconductor Corporation
25 3D Integration at Ziptronix, Inc.
26 3D Integration at ZyCube Sendai Lab.

Part IV -
Design, Performance, and Thermal Management
27 Design for 3D Integration at NC State University
28 Design for 3D Integration at Fraunhofer IIS-EAS
29 Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D Technology
30 Computer-aided Design for 3D Circuits at the University of Minnesota
31 Electrical Performance of 3D Circuits
32 Testing of 3D Circuits
33 Thermal Management of Vertically Integrated Packages at IBM Zurich

Part V -
34 3D and Microprocessors
35 3D Memories
36 Sensor Arrays
37 Power Devices
38 Wireless Sensor Systems -
The e-CUBES Project

39 Conclusions