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Handbook of 3D Integration, Voume 4: Design, Test, and Thermal Management

Handbook of 3D Integration, Voume 4: Design, Test, and Thermal Management

Philip Garrou, Mitsumasa Koyanagi, Peter Ramm, Paul D. Franzon, Eric J. Marinissen, Muhannad S. Bakir

ISBN: 978-3-527-69706-9

Jan 2019

265 pages


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This fourth volume of the landmark handbook focuses on the design, testing and thermal management of 3D-integrated devices, both from a technological and a materials science perspective.
Edited and authored by key figures from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including the particular challenges and potential. The second part is concerned with the test methods used to assess the quality and reliability of the 3D-integrated devices, while the third and final part deals with thermal management.
3D Design Styles
Design Enablement and Advantages of Ultra-Fine Pitched 3D-Stacked Integrated Circuits
Wyoming Case Study
IBM Interposers
Interposer Interconnect Circuits
Signal Integrity for 3D
Power Integrity for 3D
2.5D/3D Design Flow
Monolithic 3D
EDA for 3D
3D Memories
3D Clock Distribution
Cost Modelling for 2.5D and 3D Stacked ICs
Interconnect Testing for 2.5D and 3D Stacked ICs
Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps
3D Design-for-Test Architecture
Optimization of Test-Access Architectures and Test Scheduling for 3D ICs
IEEE P1838 3D Test Access Standard-in-Development
Test and Debug Strategy for TSMC CoWoS Stacking Process Based Heterogeneous 3D IC: A Silicon Case Study
Thermal Challenges and Emerging Solutions for 3D and 2.5D IC
Thermal Modeling and Experimental Model Validation for 3D Stacked ICs
Thermal Design for 3D ICs with Micro-Fluidics