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Interconnect Materials for Harsh Environment Electronics

Interconnect Materials for Harsh Environment Electronics

Ahmed Sharif

ISBN: 978-3-527-81397-1

Aug 2019

256 pages

Select type: E-Book

$131.99

Product not available for purchase

Description

The book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. Chapters written by experts from academia and industry cover interconnect materials based on silver, gold and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials. The second main part of the book is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.
Interconnects -
Introduction
PART I. MATERIALS
Nano Ag
Ag-based Alloys
Au-based Alloys
Zn-based Alloys
Transient Liquid Phase
Polymer-based Joining
Nanotechnology-based Solutions
Intermetallic Compounds
PART II. PERFORMANCE ASSESSMENT
Lifecycle Assessment
High-Temperature Performance
Mechanical Performance
Under Bump Metallurgy (UBM) Engineering
Lead-Free Reliability
Simulation and Modelling