Skip to main content

Reliability of MEMS: Testing of Materials and Devices

Reliability of MEMS: Testing of Materials and Devices

Osamu Tabata (Editor), Toshiyuki Tsuchiya (Editor), Oliver Brand (Series Editor), Gary K. Fedder (Series Editor), Christofer Hierold (Series Editor), Jan G. Korvink (Series Editor)

ISBN: 978-3-527-67503-6

Mar 2013

324 pages



This edition of 'Reliability of MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, one of the most important hurdles to commercialization for microelectromechanical systems is covered in detail: the reliability of MEMS materials and devices. Due to their microscale size combined with novel functionalities, a whole new category of challenges arises, and proper determination of a given device's reliability is instrumental in determining its range of usability and application fields. Any kind of gadget's performance, lifetime and safety will depend on the continued and predictable functioning of both the electronic as well as the micromechanical parts. MEMS reliability therefore can be as serious as human life-and-death matters - quite literally in the case of roll-over sensors for cars, for example.
Introduction -
Reliability Issues in MEMS
Part I: Mechanical Reliability of MEMS Materials
Mechanical Properties of MEMS Materials
Bulge Methods
Bending Test using Probe Tools
Uni-axial Tensile Test with Specialized Chucking Methods
On-chip Microstructures
Part II: Reliability of MEMS Devices
Pressure Sensors
Inertial Sensors
Optical MEMS
""The book will undoubtedly be of interest to MEMS practitioners and researchers."" (Journal of Applied Electrochemistry, February 2008)