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Structure, Deformation, and Integrity of Materials, 2 Volume Set

Structure, Deformation, and Integrity of Materials, 2 Volume Set

Gijsbertus de With

ISBN: 978-3-527-61203-1

Jan 2008

894 pages


This first integrated approach to thermomechanics deals equally with the atomic scale, the mesoscale of microstructures and morphology, as well as the macroscopic level of actual components and workpieces for applications. With some 85 examples and 150 problems, it covers the three important material classes of ceramics, polymers, and metals in a didactic manner. The renowned author surveys mechanical material behavior at both the introductory and advanced level, providing reading incentive to both students as well as specialists in such disciplines as materials science, chemistry, physics, and mechanical engineering. Backed by five appendices on symbols, abbreviations, data sheets, materials properties, statistics, and a summary of contact mechanics.
Volume I: Fundamentals and Elasticity
A. Overview
Constitutive Behaviour
B. Basics
Mathematical Preliminaries
C, Q and S Mechanics
Structure and Bonding
C. Elasticity
Continuum Elasticity
Elasticity of Structures
Molecular Basis of Elasticity
Microstructural Aspects of Elasticity
Appendix A: Units, Physical Constants and Conversion Factors
Appendix B: Properties of Structural Materials
Appendix C: Properties of Plane Areas

Volume II: Plasticity and Fracture
D. Plasticity
Continuum Plasticity
Applications of Plasticity Theory
Dislocations and Plasticity
Mechanisms in Polymers
Continuum Visco-elasticity
Applications of Visco-elasticity Theory
Structural Aspects of Visco-elasticity
E. Fracture
Continuum Fracture
Applications of Fracture Theory
Structural Aspects of Fracture
Perspective and Outlook
Appendix D: Statistics
Appendix E: Contact Mechanics
""With…has prepared a wonderful book…highly recommended."" (CHOICE, October 2006)

""…the author skillfully stitch[es]...aspects of chemistry, physics, and mechanical engineering to build this timeless reference on the material sciences."" (Electric Review, September/October 2006)